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Book

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Title

2015 3rd IAPR Asian Conference on Pattern Recognition (ACPR)

Year of publication

2015

Book type

conference proceedings

Publication language

polish

Publisher name

IEEE

Publisher name from the Ministry list

Institute of Electrical and Electronics Engineers (IEEE)

Date of publication

2015

Number of pages

830

ISBN

978-1-4799-6100-9

URL

https://ieeexplore.ieee.org/xpl/conhome/7484414/proceeding

Chapters
Skeleton-based audio envelope shape analysis (p. 514-518)
Conference

3rd IAPR Asian Conference on Pattern Recognition (ACPR 2015), 3-6.11.2015, Kuala Lumpur, Malaysia

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