SIS PUT | Journal of Thermal Stresses

Depending on the amount of data to process, file generation may take longer.

If it takes too long to generate, you can limit the data by, for example, reducing the range of years.

Menu

Scientific Information System of the Poznań University of Technology

PL EN

Main page / Journals / Journal of Thermal Stresses

Journal

Title

Journal of Thermal Stresses

Scientific disciplines (Law 2.0)

2.5 Biomedical engineering
2.8 Materials engineering
2.9 Mechanical engineering
2.10 Environmental engineering, mining and energy
3.1 Medical biology
7.2 Biotechnology
7.7 Physical sciences

Journal unique ID

13047

Publisher name

Taylor & Francis

ISSN

0149-5739

eISSN

1521-074X

Current scoring

70

Journal year Ministry points Impact Factor
2005 --- 0,756
2006 --- 0,861
2007 --- 0,872
2014 25 0,992
2021 70 3,456
2023 70 2,6

System created by Poznań University of Technology and Poznan Supercomputing and Networking Center

Log in through eKonto to add to SIS

This website uses cookies to remember the authenticated session of the user. For more information, read about Cookies and Privacy Policy.