Modeling and simulation of highly inductive on-chip interconnects

Agnieszka Ligocka; Wojciech Bandurski

doi:10.1109/SPI.2006.289231

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Title

Modeling and simulation of highly inductive on-chip interconnects

Authors

Agnieszka Ligocka (WEiT) ^{[ 1 ][ P ]}
Wojciech Bandurski (WEiT) ^{[ 1 ][ P ]}

^{[ 1 ]} Katedra Telekomunikacji Multimedialnej i Mikroelektroniki, Wydział Elektroniki i Telekomunikacji, Politechnika Poznańska | ^{[ P ]} employee

Year of publication

2006

Chapter type

paper

Publication language

english

Abstract

EN In the paper we present our approach to estimation of the transmission line step response. The main idea of the presented approach is to approximate the output signal of the lossy line, by analysis the behavior of the lossless transmission line. The output signal is expanded in the series of traveling waves. We construct the conditions when the first incident wave of lossless line is good approximation of the step response of the line.

Pages (from - to)

235 - 238

DOI

10.1109/SPI.2006.289231

URL

https://ieeexplore.ieee.org/document/4069466

Book

10th IEEE Workshop on Signal Propagation on Interconnects : Proceedings of the International Conference, Berlin, May 2006

Presented on

10th IEEE Workshop on Signal Propagation on Interconnects, 2006, Berlin, Germany

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