Title
Reflow Oven for Heating and Soldering SMD and BGA Components
Authors
[ 1 ] Instytut Automatyki i Robotyki, Wydział Informatyki, Politechnika Poznańska | [ P ] employee
Scientific discipline (Law 2.0)
Year of publication
2018
Chapter type
chapter in monograph / paper
Publication language
english
Keywords
EN
- reflow owen
- soldering
- surface mounted devices
- ball grid arrays
- components
Pages (from - to)
324 - 329
Open Access Mode
publisher's website
Open Access Text Version
final published version
Ministry points / chapter
20
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