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Article

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Title

Low Cost Hypercompression of Test Data

Authors

[ 1 ] Wydział Informatyki i Telekomunikacji, Politechnika Poznańska | [ 2 ] Instytut Radiokomunikacji, Wydział Informatyki i Telekomunikacji, Politechnika Poznańska | [ P ] employee

Scientific discipline (Law 2.0)

[2.3] Information and communication technology

Year of publication

2020

Published in

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Journal year: 2020 | Journal volume: vol. 39 | Journal number: no. 10

Article type

scientific article

Publication language

english

Keywords
EN
  • design for testability
  • embedded test
  • isometric compression
  • scan-based testing
  • test data compression
Pages (from - to)

2964 - 2975

DOI

10.1109/TCAD.2019.2945760

URL

https://ieeexplore.ieee.org/document/8861091

Ministry points / journal

100

Ministry points / journal in years 2017-2021

100

Impact Factor

2,807

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