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Article

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Title

The Estimated Temperature of the Semiconductor Diode Junction on the Basis of the Remote Thermographic Measurement

Authors

[ 1 ] Instytut Elektrotechniki i Elektroniki Przemysłowej, Wydział Automatyki, Robotyki i Elektrotechniki, Politechnika Poznańska | [ 2 ] Instytut Elektroenergetyki, Wydział Inżynierii Środowiska i Energetyki, Politechnika Poznańska | [ P ] employee

Scientific discipline (Law 2.0)

[2.2] Automation, electronics, electrical engineering and space technology

Year of publication

2023

Published in

Sensors

Journal year: 2023 | Journal volume: vol. 23 | Journal number: iss. 4

Article type

scientific article

Publication language

english

Keywords
EN
  • diode
  • LabVIEW
  • semiconductor die
  • silicon carbide
  • SolidWorks
  • thermography
Abstract

EN The value of a semiconductor’s diode temperature determines the correct operation of this element and its useful lifetime. One of the methods for determining the die temperature of a semiconductor diode is through the use of indirect thermographic measurements. The accuracy of the thermographic temperature measurement of the diode case depends on the prevailing conditions. The temperature of the mold body (the black part of the diode case made of epoxy resin) depends on the place of measurement. The temperature of the place above the die is closer to the die temperature than the temperature of mold body fragments above the base plate. In addition, the difficulty of its thermographic temperature measurement increases when the surface whose temperature is being measured is in motion. Then, the temperature measured by thermography may not apply to the warmest point in the case where the die temperature is determined. Information about the difference between temperatures of the different parts of the mold body and the die may be important. For this reason, it was decided to check how much the temperature measurement error of the die diode changes if the temperature of the diode case is not measured at the point that is above the die.

Pages (from - to)

1944-1 - 1944-19

DOI

10.3390/s23041944

URL

https://www.mdpi.com/1424-8220/23/4/1944

Comments

article number: 1944

License type

CC BY (attribution alone)

Open Access Mode

open journal

Open Access Text Version

final published version

Date of Open Access to the publication

at the time of publication

Full text of article

Download file

Access level to full text

public

Ministry points / journal

100

Impact Factor

3,9 [List 2022]

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