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Article

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Title

Processing of PtSe2 ultra-thin layers using Ar plasma

Authors

[ 1 ] Instytut Fizyki, Wydział Inżynierii Materiałowej i Fizyki Technicznej, Politechnika Poznańska | [ 2 ] Wydział Inżynierii Materiałowej i Fizyki Technicznej, Politechnika Poznańska | [ 3 ] Instytut Badań Materiałowych i Inżynierii Kwantowej, Wydział Inżynierii Materiałowej i Fizyki Technicznej, Politechnika Poznańska | [ P ] employee | [ SzD ] doctoral school student

Scientific discipline (Law 2.0)

[2.8] Materials engineering

Year of publication

2023

Published in

Materials Science in Semiconductor Processing

Journal year: 2023 | Journal volume: vol. 167

Article type

scientific article

Publication language

english

Keywords
EN
  • PtSe2
  • Plasma processing
  • Optical lithography
  • Raman spectroscopy
Abstract

EN This paper contains a detailed analysis of the Ar plasma treatment dynamics of the PtSe2/Al2O3 system comprising ultrathin PtSe2 layers with a thickness of 1–3 monomolecular layers. The impact of the etching process on the physical properties of the ultrathin PtSe2 layers was analysed using Raman spectroscopy and atomic force microscopy techniques in time intervals up to the complete decomposition of the PtSe2 layers. The processing duration that allowed the complete removal of the PtSe2 layer was determined for the investigated systems. The results, in combination with the optimised photolithography, were used for the active PtSe2 channel formation in the 3 ML PtSe2-based transfer line measurement structure using electrodes consisting of Ni and Au layers (with thicknesses of 20 and 40 nm, respectively). The electrical properties of the fabricated system confirm the effectiveness of commercially available PtSe2/Al2O3 samples in the fabrication of simple electronic devices utilising planar architecture, i.e. micro- and nanosensors.

Date of online publication

28.08.2023

Pages (from - to)

107814-1 - 107814-7

DOI

10.1016/j.mssp.2023.107814

URL

https://www.sciencedirect.com/science/article/pii/S1369800123005073?via%3Dihub

License type

CC BY-NC-ND (attribution - noncommercial - no derivatives)

Open Access Mode

czasopismo hybrydowe

Open Access Text Version

final published version

Date of Open Access to the publication

at the time of publication

Ministry points / journal

70

Impact Factor

4,1 [List 2022]

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